International Micro Industries, Inc. (IMI) is engaged in contract production, research, manufacturing, advanced machine design, and packaging for the Semiconductor and Electronics Industry. Incorporated in 1971, IMI has over 35 years of experience in delivering semiconductor packaging solutions to the defense and commercial industry. IMI is a pioneer in the industry and is recognized for its contribution to advanced semiconductor packaging.

The company concentrates in the advanced semiconductor chip assembly and packaging technologies of Wafer Bumping, Chip on Glass (COG), Flip Chip and Tape Carrier Packages. These technologies have broad application in chip interconnection for Flat Panel Displays, Chip Scale Packages, Ink Jet Print Heads and other chip based microelectronic products. IMI’s primary focus is to become a high volume supplier of bare chip packaging services to the rapidly growing flip chip and flat panel display business around the World.

Drawing on years of process knowledge and machine design innovation, IMI has developed and reduced to commercial practice a bumping process for Gold, Solder, Indium, and Copper die bumps. Additionally, our process can be used to electroplate almost any metal onto a semiconductor surface. This enables flexible solutions to many semiconductor and MEMS packaging problems.

IMI also has the capability to format Polyimide and similar films used in the production of CSP and other Tape Carrier Packages.