WAFER BUMPING

IMI can produce electroplated structures on numerous substrates.

Metals Plated:                                   Substrates:

• Gold                                                 • Si
• Solder                                              • GaAs
• Copper                                             • Ceramic
• Indium                                              • Glass
• NiFe (Permalloy®)

IMI's Experience With Thick Resist Technology

Shapes:                                            Size:

• Any                                                 • 5 micron to 10 micron pitch demonstrated

FILM FORMATTING & FLEXIBLE SUBSTRATE

IMI has the capability to process bulk process plastic films into custom shapes.
• Polyimide
• Polyester
• Polypropylene

We have slitting, punching and design capability to produce the shapes you desire.
• 35mm
• 48mm
• 70mm

CONSULTING ACTIVITIES OF IMI

• Chip on Glass – design & fabrication
• Tape Carrier – design & fabrication
• Custom Assembly Machinery
• TAB Bonding
• ACP & ACT
• MEMS:  Electroplated Structures