Wafer Bumping Customers Served for Flip Chip & Bare Die Applications

COMPUTER

• Workstations/Servers – high pin count ASIC, CPU and fast SRAM packages
• Personal Computers – array processors
• High Speed Graphics – chip sets & modules
• Hard Disk Drives – light weight preamplifier chips on flying read/write heads

MEDICAL

• Medical Implantable
• Medical Disposable
• Hearing Aids – TAB (tape automated bonding)

AUTOMOTIVE

• Voltage Regulators
• Sensors

TELECOMMUNICATION

• Switching, Transmission and Network Systems – switch modules

OPTOELECTRONICS

• DWDM Applications – transmitter and receiver packages

WIRELESS

• Bluetooth – RF & baseband devices, flash memory, voltage regulators
• Mobile Phones & PDAs – wafer level packages, voltage regulators, battery    monitors and stacked packages

DISPLAYS

• TAB (tape automated bonding)
• COG (chip-on-glass)
• COF (chip-on-flex)

IC CARDS

• Smart Cards
• RF ID
• EAS Tags

MEMS MANUFACTURING